ラジオエレクトロニクス向け サーモエレクトリッククーラー
Thermoelectric Coolers for Radio Electronics (Microcoolers)◆ 高感度レシーバ＆アンプの入力ステージ
◆ 半導体レーザ、IR ディテクタ、CCD
◆ フォトマルチプライヤ
◆ マイクロプロセッサ
Kryotherm 社のラジオエレクトロニクス向け サーモエレクトリッククーラーは、マイクロチップ、半導体レーザ、光検出器など温度センシティブな電子部品用の小型クーラーです。TO（TO3, TO8 等）, HHL, DIL, バタフライなどへのパッケージングも可能です。
真空（< 10-6 torr）中や、大きな機械的負荷があるなど、特殊環境対応の製品も製造いたします。またサイズ、冷却速度、冷却パワー密度などの特注仕様も承ります。
| Name *1 | Imax (A) |
Qmax (W) |
Umax (V) |
dTmax (K) |
R (Ω) |
A (mm) |
B (mm) |
C (mm) |
D (mm) |
H (mm) |
| TB-8-0.45-1.3 | 0.7 | 0.4 | 1.0 | 67 | 1.20 | 3.4 | 3.4 | 5.0 | 3.4 | 2.30 |
| TB-12-0.45-1.3 | 0.7 | 0.6 | 1.4 | 67 | 1.80 | 3.4 | 5.0 | 5.0 | 5.0 | 2.30 |
| TB-18-0.45-1.3 | 0.7 | 0.9 | 2.2 | 67 | 2.80 | 5.0 | 5.0 | 6.6 | 5.0 | 2.30 |
| TB-32-0.45-1.3 | 0.7 | 1.7 | 3.9 | 67 | 5.00 | 6.6 | 6.6 | 8.3 | 6.6 | 2.30 |
| TB-66-0.45-1.3 | 0.7 | 3.5 | 8.0 | 67 | 10.00 | 9.1 | 9.9 | 11.5 | 9.1 | 2.30 |
| TB-7-0.6-1.5 | 1.1 | 0.6 | 0.9 | 69 | 0.59 | 4.3 | 4.3 | 4.3 | 4.3 | 3.25 |
| TB-11-0.6-1.5 | 1.1 | 0.9 | 1.4 | 69 | 0.91 | 4.0 | 9.0 | 4.0 | 9.0 | 3.25 |
| TB-17-0.6-1.5 | 1.1 | 1.4 | 2.1 | 69 | 1.50 | 6.3 | 6.3 | 6.3 | 6.3 | 3.25 |
| TB-31-0.6-1.5 | 1.1 | 2.6 | 3.8 | 69 | 2.65 | 8.0 | 8.0 | 8.0 | 8.0 | 3.25 |
| TB-35-0.6-1.5 | 1.1 | 3.0 | 4.3 | 69 | 3.10 | 6.0 | 12.0 | 6.0 | 12.0 | 3.25 |
| TB-65-0.6-1.5 | 1.1 | 5.5 | 8.1 | 69 | 5.60 | 12.0 | 13.0 | 12.0 | 13.0 | 3.25 |
| TB-7-0.6-1.2 | 1.4 | 0.7 | 0.9 | 69 | 0.51 | 4.3 | 4.3 | 4.3 | 4.3 | 2.95 |
| TB-11-0.6-1.2 | 1.4 | 1.2 | 1.4 | 69 | 0.75 | 4.0 | 9.0 | 4.0 | 9.0 | 2.95 |
| TB-17-0.6-1.2 | 1.4 | 1.8 | 2.1 | 69 | 1.20 | 6.3 | 6.3 | 6.3 | 6.3 | 2.95 |
| TB-31-0.6-1.2 | 1.4 | 3.3 | 3.8 | 69 | 2.05 | 8.0 | 8.0 | 8.0 | 8.0 | 2.95 |
| TB-35-0.6-1.2 | 1.4 | 3.7 | 4.3 | 69 | 2.40 | 6.0 | 12.0 | 6.0 | 12.0 | 2.95 |
| TB-65-0.6-1.2 | 1.4 | 6.9 | 8.1 | 69 | 4.60 | 12.0 | 13.0 | 12.0 | 13.0 | 2.95 |
| TB-7-0.6-1.0 | 1.7 | 0.9 | 0.9 | 69 | 0.39 | 4.3 | 4.3 | 4.3 | 4.3 | 2.75 |
| TB-11-0.6-1.0 | 1.7 | 1.4 | 1.4 | 69 | 0.62 | 4.0 | 9.0 | 4.0 | 9.0 | 2.75 |
| TB-17-0.6-1.0 | 1.7 | 2.2 | 2.1 | 69 | 0.95 | 6.3 | 6.3 | 6.3 | 6.3 | 2.75 |
| TB-31-0.6-1.0 | 1.7 | 3.9 | 3.8 | 69 | 1.70 | 8.0 | 8.0 | 8.0 | 8.0 | 2.75 |
| TB-35-0.6-1.0 | 1.7 | 4.4 | 4.3 | 69 | 2.08 | 6.0 | 12.0 | 6.0 | 12.0 | 2.75 |
| TB-65-0.6-1.0 | 1.7 | 8.3 | 8.1 | 69 | 4.00 | 12.0 | 13.0 | 12.0 | 13.0 | 2.75 |
| TB-7-0.6-0.8 | 2.1 | 1.1 | 0.9 | 68 | 0.34 | 4.3 | 4.3 | 4.3 | 4.3 | 2.55 |
| TB-17-0.6-0.8 | 2.1 | 2.6 | 2.1 | 68 | 0.76 | 6.3 | 6.3 | 6.3 | 6.3 | 2.55 |
| TB-31-0.6-0.8 | 2.1 | 4.8 | 3.8 | 68 | 1.40 | 8.0 | 8.0 | 8.0 | 8.0 | 2.55 |
| TB-35-0.6-0.8 | 2.1 | 5.4 | 4.3 | 68 | 1.70 | 6.0 | 12.0 | 6.0 | 12.0 | 2.55 |
| TB-65-0.6-0.8 | 2.1 | 10.1 | 8.0 | 68 | 3.00 | 12.0 | 13.0 | 12.0 | 13.0 | 2.55 |
| TB-109-0.6-0.8 | 2.1 | 16.9 | 13.4 | 68 | 5.30 | 12.0 | 26.0 | 12.0 | 26.0 | 2.55 |
| TB-17-1.0-0.7 | 6.6 | 8.4 | 2.1 | 68 | 0.24 | 8.0 | 8.0 | 8.0 | 8.0 | 2.45 |
| TB-19-0.45-0.6 *5 | 1.5 | 1.95 | 2.3 | 68 | 1.1 | 6.6 | 3.8 | 5.0 | 3.8 | 1.20 |
| TB-31-0.6-0.8 *5 | 2.1 | 4.80 | 3.8 | 68 | 1.4 | 6.2 | 10.2 | 6.2 | 12.0 | 2.20 |
| TB-35-1.0-0.7 *5 | 2.1 | 5.50 | 4.3 | 68 | 1.7 | 6.0 | 12.0 | 6.0 | 12.0 | 1.85 |
| ● Standard Terms of Delivery | ||||||||||
| Substrate Material | alumina (BK-96) | |||||||||
| Height Tolerance | ± 0.15 mm (L0) | |||||||||
| Parallelism | 0.15 mm (L0) | |||||||||
| Flatness | 0.01 mm (L0) | |||||||||
| Cable Length | 50 mm | |||||||||
| Pin Orientation | to the longer side (for rectangular coolers) | |||||||||
| Operating Temperature | up to 80 ℃, maximal assembly temperature 120 ℃ (assembly solder Tm = 139 ℃) |
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| ● Additional Options | ||||||||||
| Notation *2 | Description | |||||||||
| HT(120) | operating temperature up to 120 ℃, max assembly temperature = 130 ℃ *3, assembly solder with Tm = 139 ℃ |
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| HT(150) *3 | operating temperature up to 150 ℃, max assembly temperature = 170 ℃ *3, assembly solder Pb-Sn with Tm = 183 ℃ *4 |
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| HT(200) | operating temperature up to 200 ℃, max assembly temperature = 220 ℃ *3, assembly solder with Tm = 232 ℃ |
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| L1 | height tolerance = ± 0.05 mm; parallelism 0.03 mm; flatness 0.02 mm. | |||||||||
| L2 | height tolerance = ± 0.025 mm; parallelism 0.02 mm; flatness 0.015 mm. | |||||||||
| mc95, mh95, mm117 etc. |
metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95, 117, 139, 183 ℃) |
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| mcAu, mhAu, mmAu |
gold plating, metallization Cu-Ni-Au (0.2〜1 micron) | |||||||||
| N | substrate material - aluminium nitride (AlN), heat conductivity > 180 W/mK | |||||||||
| E, S, U, Cc | sealant: epoxy, silicon, urethane, conformal coating | |||||||||
| - | non-standard pin orientation | |||||||||
| - | type and length of wires by customer's requirement | |||||||||
| - | soldering on cold or hot heatsink, packaging or cold block | |||||||||
*1 An universal abbreviation is used to notate single-stage coolers: TB-N-C-h, where:
TB - product abbreviation - thermoelectric battery (cooler);
N - number of thermocouples in the cooler;
C - length of the rib of the thermoelectric element basis (in millimeters);
h - height of the thermoelectric element (in millimeters)
For example, in the module TB-109-0.6-0.8: 109 thermocouples (218 thermoelectric elements), every element has the cross-section of 0.6×0.6 mm and is 0.8 mm high.
*2 the notations shown are used to notate additional options in cooler name
*3 the maximum assembly temperature influence on the module must not exceed 2 minutes
*4 Important ! TEC with this option does not satisfy ROHS requirements.
*5 Special
＊仕様は予告なく変更になる場合がございます。
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